Bondable Enamels is available in different types depending on the compositions that are used, e.g. polyamide, phenoxy, aromatic polyamide. Used for shaping of DY coils, CTC wires, phonetic coils etc.
Thermal Index: 130
Chemical Basis: Polyamide
General purpose bondable enamel based on aliphatic copolyamide resins. Bonds at 140-170℃, excellent bonding strength, good humidity resistance. Resoftening at around 130-140℃.
Thermal Index: 130
Chemical Basis: Phenoxy Resin
General purpose bondable enamel based on phenoxy resins. Cresylic solvent system. Easy enameling, with good bonding strength. Bonds at140-170℃, resoftening temperature at around 140-150℃.
Thermal Index: 180
Chemical Basis: Aromatic Copolyamide
High resoftening temperature bondable enamel, mainly based on aromatic polyamide. NMP solvent system. Bonds at 180-220℃, with high bonding strength. Coils bonded can be removed from models at high temperature. Cure in the same oven with base coat.
| Primary applications/ special characteristics | Conductor diameter mm | Chemical base | Bonding of coils | Resoftening temperature |
| bonding condition/ bonding strength | bonding condition/ resoftening temperature | |||
| Bond top coat over polyurethane | 0,01 – 1,00 | Polyvinylbutyral | 1h 140°C /1,6 N | 1h 140°C /108°C |
| Bond top coat over polyesterimide or polyurethane | 0,02- 2,00 | Polyamide | 1h 170°C /2,6 N | 1h 170°C /164°C |
| Bond top coat over polyesterimide or polyurethane with high resistance against humidity | 0,02 – 2,00 | Polyamide | 1h 170°C /2,3 N | 1h 170°C /206°C |
| Bond top coat over polyesterimide or polyurethane with short mould release of bonded wire subjects | 0,02 – 2,00 | Polyamide modified 1h 170°C / 3,0 N 1h 170°C / 250°C | 1h 170°C /3,0 N | 1h 170°C /250°C |